EEL 4331 - Solid State Technology

 

Catalog Description: (3cr) Principles of solid-state device fabrication.

Prerequisites: Solid State Devices

Textbook: The Science and Engineering of Microelectronic Fabrication, 2nd Ed. S,A, Campbell. (2001) Oxford University Press, ISBN: 0-19-513605-5

Course Objective: The objective of this course is to provide undergraduate and entry-level graduate students with an understanding of microelectronics fabrication processing technologies.  The class will prepare students for: (1) careers in the semiconductor industry, (2) hands-on research relating to microelectronics processing, and (3) follow-on classes in devices and circuits (e.g. solid-state devices, VLSI, MEMS, optoelectronics, nanotechnology, etc.)

Professional Component: 3 credits of Engineering Science

Relationship to Outcomes:  (To view how the outcomes of this course fit in with the curriculum, click here)

• EE1 - knowledge of probability and statistics, including applications
  • Use and analysis of delta functions, error functions, and Gaussian distributions to model diffusion and ion implantation dopant profiles.
• EE2 - knowledge of mathematics, basic and engineering sciences necessary to analyze and design complex systems
  • Ability to analytically model unit process steps which comprise more complex fabrication process flows
• a - an ability to apply knowledge of mathematics, science, and engineering
  • Application of mathematical models to model physical phenomena (e.g. oxidation, diffusion, ion implantation, vapor deposition, vacuum systems, optical lithography, etc.)
• e - an ability to identify, formulate, and solve engineering problems
  • Ability to interpret and/or develop complex fabrication process flows using a sequence of inter-dependent process steps.
• k - an ability to use the techniques, skills, and modern engineering tools necessary for engineering practice
  • Use of MATLAB or other software to plot, compare, and interpret data.

Class Schedule:  3 classes per week of 50 minutes each

Topics:

Intro to Microelectronic Fabrication Semiconductor Substrates Thermal Oxidation Diffusion Ion Implantation Optical Lithography Photoresists Vacuum Systems

Etching Physical Deposition Chemical Vapor Deposition Device Isolation, Contacts, and Metallization CMOS Technologies Bipolar Technologies MEMS Integrated Circuit Manufacturing

Course Committee:  Dr. Arnold, Chair, Dr. Ural, Dr. Law, Dr. Neugroschel

Course Committee Reports for:

Fall Term		Spring Term		Summer Term
2006		2006